- The background of the diamond wire saw machine
People commonly used to cut crystal, wafer, and sapphire hard materials by ID saw with a reciprocating wire saw coating the diamond powder inside before the 1980s. However, the low output makes it more and more difficult to meet the daily increasing market demand. People are eager to look for more efficient ways to reduce the cutting costs and increase productivity. Thus, the multi-wire cutting saw technology is gradually developed and coming out.
- Do you know the principle of the multi-wire saw process?
It is very different from the traditional way of saw blade grinding wheel cutting, ID saw cutting, and laser cutting. The process of multi-wire saw is a high-speed wire drive attached to the wire on the blade material and silicon rod friction to achieve the cutting effect In the whole process, the steel wire is guided by more than a dozen silk wheels, forming a screen on the main silk roller, and the workpiece to be processed is fed down by the table.
- What’s the advantage of multi-wire saw technology?
Multi-wire saw works with the diamond wire rope to slice the hard and valuable materials blocks into sliced pieces with different thicknesses based on high precision. Compared with other technologies, diamond multi-wire cutting machines have the advantages of high efficiency, high productivity, high accuracy, and high precision. It is currently widely used in sapphire, semiconductors, silicon wafers, magnets, optical glass, quartz crystals, special ceramics, and rare metals materials slicing. With the advantages of high precision, low korf loss, no broken edge, small surface damage, and roughness, people can fully work with a diamond multi-wire saw on brittle materials by squaring, bricking, and ultra-thin Cutting even with the special request on tile-shaped or ring Shaped.