The basic principle of a multi-wire saw is using a high-speed movement of diamond wire by repeated friction and cutting into thousands of pieces with low korf loss and high precision. Nowadays, the advanced multi-wire saw technology has widely replaced the ID saw by slicing hard brittle materials such as sapphire, magnet, optical glass, quartz crystals, special ceramics, artificial gemstone, rare metal, alloy, semiconductor materials, and other hard and valuable materials.
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