Description
This series was design for slicing sapphire stick, and the size under 4 inch. Due to the swing function, the slicing speed increased significantly. It ensured the efficiency while reduced costs for customers.
Cutting Samples
Sapphire 4inch multi-wire saw
- Model No.:DS102S
- Available Materials:4inch sapphire
- Max Cutting Size:Φ102X300mm
- Cutting Size:Straight flake
- Cutting Speed:max 1200m/min
Features
- Upper workbench:downward movement
- Swing slicing:swing angle 7℃&efficient with low kerf loss
- Low consumption:total consumption less than 18KW
- Less guides reduced to 8 pieces&Easy winding
- Much stable:the casted frame makes running environment stable.
- High precision cutting:the thickness deviation less than 0.005mm
- High speed:Max speed 1200m per min.
- Simply&Convenient operation:the opening workspace easily operation.
- Compact structure:One-piece Unit Structure
- Fast install:double cone for rollers and line wheels.
Technical Parameters
| Item | Detail | Parameters |
| Ability | Max work size | Φ102X300mm |
| Thickness | ≤4mm | |
| Roller | Component | Resin(PE or PU) |
| Workable diameter | 160mm≤Φd≤180mmx2 | |
| Wire | Steel wire diameter | Φ0.10mm-Φ0.18mm |
| Diamond wire diameter | Φ0.13mm-Φ0.3mm | |
| Storage | 30km(Φ0.25mm) | |
| Wire Running | Running speed | max1200m/min |
| Repeat rate | max 12 times/min | |
| Running direction | Bidirectional | |
| Workbench | Lift stroke | max 160mm |
| Lift speed | 0.1-999.9mm/hour | |
| Mortar&Fluid | Storage | 83L |
| Flow rate | 170L/min | |
| Control Devices | System | YASKAWA |
| Touch screen&PLC&Motion controller | ||
| Motor Power | 8 Servo Motor | 32.6kW |
| Mortar Motor | 3kW | |
| Refrigerator | 3.5kW | |
| Power&Air Supply | Power | AC380V Three-phase four-wire system |
| Power consumption | ≤18 kW | |
| Air supply | Air pressure≤0.4Mpa | |
| Size&Weight | Size | 2040mm×2510mm×2250mm |
| Weight | 4500kg | |
Related products
-
Low kerfloss diamond wire saw
Learn More +- Model No.:DS600
- Available Materials:crystal, artificial gem,monocrystalline silicon, ceramics ect.
- Max Cutting Size:165mm×600mm×130mm
- Running Speed:1800m/min
-
Ultrathin slicing diamond wire saw
Learn More +- Model No.:DS2131
- Available Materials:under 4mm thickness brittle&hard materials
- Max Cutting Size:210mm×310mm×100mm
- Cutting Size:thinner Straight flake
- Running Speed:max 1000m/min
-
Silicon multi-wire saw
Learn More +- Model No.:DS350
- Available Materials:silicon Carbide, gallium nitride and sapphire.
- Max Cutting Size:φ205mm×350mm 220mm×200mm×350mm
- Running Speed:1500m/min
