This series is specially designed for cutting semiconductor silicon wafers. The maximum cutting width is 300×500×300mm with diamond wire cutting. It has a precise temperature control system, high slice precision, small warpage, stable slice quality and low cutting cost.
| Item | Detail | Parameters |
| Ability | Max work size | Φ300mmX500mmX300mm |
| Roller | Component | Resin(PE or PU) |
| Workable diameter | 180mm≤Φd≤200mmx4 | |
| Wire | Diamond wire diameter | Φ0.12mm-Φ0.25mm |
| Storage | 30km(Φ0.25mm) | |
| Wire Running | Running speed | max1500m/min |
| Repeat rate | max 12 times/min | |
| Running direction | Bidirectional | |
| Workbench | Lift stroke | max 360mm |
| Lift speed | 0.1-999.9mm/hour | |
| Mortar&Fluid | Storage | 280L |
| Flow rate | 300L/min | |
| Control Devices | System | SIMENS |
| Touch screen&PLC&Motion controller | ||
| Motor Power | Servo Motor | 77.2kW |
| Mortar Motor | 3.7kW | |
| Refrigerator | 3.5kW | |
| Power&Air Supply | Power | AC380V Three-phase four-wire system |
| Power consumption | ≤40 kW | |
| Air supply | Air pressure≥0.4Mpa | |
| Size&Weight | Size | 2290mm×3515mm×3030mm |
| Weight | 10000kg | |
