Description
The equipment is mainly used for high precision double-side lapping and polishing of semiconductor, sapphire, optical glass, quartz, ceramics, metal and other hard and brittle materials.
Samples

The equipment is mainly used for high precision double-side lapping and polishing of semiconductor, sapphire, optical glass, quartz, ceramics, metal and other hard and brittle materials.

| Categories | Item | 305 | 36D | 50D | 59D |
| Polishing disk | Diameter | 820 | 914 | 1282 | 1504 |
| Ceramic Plates | Diameter | 305 | 360 | 485 | 576 |
| Optimum Maching Size | 50~100 | 50~150 | 150~200 | 200 | |
| Power | Polishing disk | 11 | 11 | 18.5 | 30 |
| Polishing tool | None | 0.75×4 | 1.5×4 | 2.2 | |
| Rotation rate | Polishing disk(Max) | 80 | 90 | 65 | 50 |
| Polishing tool(Max) | None | 90 | 65 | 50 | |
| Ability | 50mm | 72 | None | None | None |
| 100mm | 16 | 16 | 36 | None | |
| 150mm | None | 8 | 24 | None | |
| 200mm | None | 4 | 16 | 20 |