Double side polishing machine

  • Model No.:LP20B
  • Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.

Description

The equipment is mainly used for high precision double-side lapping and polishing of semiconductor, sapphire, optical glass, quartz, ceramics, metal and other hard and brittle materials.

Samples

Features

  • Widely used for high precision double-side lapping.
  • Famous brand precision components to ensure the stability of grinding& polishing quality and warranty.
  • One-piece structure to ensure the stable structure and efficiency.
  • Convenient parameter setting and process mode conversion.
  • Specification and multi-power models are optional.

Technical Parameters

Item20B22B24B
Plate size(mm)Φ1350 X Φ445 X 50Φ1465X Φ497 X 50Φ1580X Φ562 X 60
Max outline(mm)Φ420Φ470Φ550
Plate size(mm)Φ1380X Φ415 X 50Φ1495 X Φ462 X 50Φ1646 X Φ496 X 60
Max outline(mm)Φ420Φ470Φ550
Number555
Tooth number(Metric system)170138152
Modulo (Metric system)344
Tooth number(British system)8895105
Modulo (British system)PCD=509.5PCD=550PCD=607.9
No.1 motorNoNoNo
No.2 motorNoNoNo
No.3 motorNoNoNo
No.4 motorYesYesYes
100mm6075No
125mm4540No
150mm303040
200mm152025