Description
The equipment is mainly used for high precision double-side lapping and polishing of semiconductor, sapphire, optical glass, quartz, ceramics, metal and other hard and brittle materials.
The equipment is mainly used for high precision double-side lapping and polishing of semiconductor, sapphire, optical glass, quartz, ceramics, metal and other hard and brittle materials.
Item | 20B | 22B | 24B |
Plate size(mm) | Φ1350 X Φ445 X 50 | Φ1465X Φ497 X 50 | Φ1580X Φ562 X 60 |
Max outline(mm) | Φ420 | Φ470 | Φ550 |
Plate size(mm) | Φ1380X Φ415 X 50 | Φ1495 X Φ462 X 50 | Φ1646 X Φ496 X 60 |
Max outline(mm) | Φ420 | Φ470 | Φ550 |
Number | 5 | 5 | 5 |
Tooth number(Metric system) | 170 | 138 | 152 |
Modulo (Metric system) | 3 | 4 | 4 |
Tooth number(British system) | 88 | 95 | 105 |
Modulo (British system) | PCD=509.5 | PCD=550 | PCD=607.9 |
No.1 motor | No | No | No |
No.2 motor | No | No | No |
No.3 motor | No | No | No |
No.4 motor | Yes | Yes | Yes |
100mm | 60 | 75 | No |
125mm | 45 | 40 | No |
150mm | 30 | 30 | 40 |
200mm | 15 | 20 | 25 |