Description
The equipment is mainly used for high precision double-side lapping and polishing of semiconductor, sapphire, optical glass, quartz, ceramics, metal and other hard and brittle materials.
Samples
Double side polishing machine
- Model No.:LP20B
- Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.
Features
- Widely used for high precision double-side lapping.
- Famous brand precision components to ensure the stability of grinding& polishing quality and warranty.
- One-piece structure to ensure the stable structure and efficiency.
- Convenient parameter setting and process mode conversion.
- Specification and multi-power models are optional.
Technical Parameters
| Item | 20B | 22B | 24B |
| Plate size(mm) | Φ1350 X Φ445 X 50 | Φ1465X Φ497 X 50 | Φ1580X Φ562 X 60 |
| Max outline(mm) | Φ420 | Φ470 | Φ550 |
| Plate size(mm) | Φ1380X Φ415 X 50 | Φ1495 X Φ462 X 50 | Φ1646 X Φ496 X 60 |
| Max outline(mm) | Φ420 | Φ470 | Φ550 |
| Number | 5 | 5 | 5 |
| Tooth number(Metric system) | 170 | 138 | 152 |
| Modulo (Metric system) | 3 | 4 | 4 |
| Tooth number(British system) | 88 | 95 | 105 |
| Modulo (British system) | PCD=509.5 | PCD=550 | PCD=607.9 |
| No.1 motor | No | No | No |
| No.2 motor | No | No | No |
| No.3 motor | No | No | No |
| No.4 motor | Yes | Yes | Yes |
| 100mm | 60 | 75 | No |
| 125mm | 45 | 40 | No |
| 150mm | 30 | 30 | 40 |
| 200mm | 15 | 20 | 25 |
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