Silicon multi-wire saw

Model No.: DS350
Available Materials: silicon Carbide, gallium nitride and sapphire.
Max Cutting Size: φ205mm×350mm 220mm×200mm×350mm
Running Speed: 1500m/min

Description

This series is mainly used for high speed, high efficiency and high precision

cutting of ultra-hard brittle materials such as silicon Carbide, gallium nitride and sapphire.

Max wire running speed:1500m/min
Beais servo drive control, fast response speed, stable and reliable performance;
Humanized operation interface, parameter setting and process mode conversion is convenient;
One-piece structure and wire-break memory system

Item	Detail	Parameters
Ability	Max work size	220200350(mm)
Ability	Max work size	Φ205*350(mm)
Roller	Component	Resin(PE or PU)
Roller	Spindle spacing	650mm
Wire	Diamond wire diameter	Φ0.12~Φ0.25(mm)
Wire Running	Running speed	max1500m/min
Wire Running	Running direction	Bidirectional
Workbench	Workbench speed	0.01~300mm/min
	Workbench itnerary	225mm
	Swing angle	±12°
	Swing frequency	30
	Feeding speed	0.01~9.99mm/min
Mortar&Fluid	Storage	300L
Mortar&Fluid	Flow rate	200L/min
	Touch screen&PLC&Motion controller
Motor Power	Spindle drive motor	17.8kW
	Mortar Motor	7.5kW
	Tesion motor	4.15kW
Power&Air Supply	Power	AC380V Three-phase five-wire system
Power&Air Supply	Accuracy of temperature control	±2℃
Size&Weight	Size	3550mm×2200mm×3000mm
Size&Weight	Weight	13500kg