Description
This series is mainly used for monocrystalline and polycrystalline silicon cropping,precious stone cutting and semiconductor materials cutting.
Application

This series is mainly used for monocrystalline and polycrystalline silicon cropping,precious stone cutting and semiconductor materials cutting.

| Product Name(DW001) | Specification(mm) | Application |
| Diamond wire loops | Φ0.65~L | Monocrystalline and polycrystalline silicon cropping Precious stone cutting Semiconductor materials cutting |
| Φ0.60~L | ||
| Φ0.50~L | ||
| Φ0.45~L |