Pricision slicing diamond wire

  • Model No.:DW004
  • Available Materials:Semiconductor silicon,monocrystalline and polycrystalline silicon.

Description

This series is mainly used for semiconductor silicon,monocrystalline and polycrystalline silicon slicing.

Application

Advantages

  • Lower cost of electricity and water during the production.
  • No slurry mixture and no need to build a slurry recycle system.
  • Without hazardous waste PEG and SiC.
  • Increase the production capacity without increasing investment.

Technical Parameters

Product Name(DW004)Specification(mm)Application
Diamond wire for silicon slicing0.07Semiconductor silicon/Monocrystalline/polycrystalline silicon slicing
0.065Monocrystalline/polycrystalline silicon slicing
0.06Monocrystalline/polycrystalline silicon slicing
0.055Monocrystalline/polycrystalline silicon slicing
0.05Monocrystalline/polycrystalline silicon slicing