Description
The equipment is mainly used for high precision double-side lapping and polishing of semiconductor, sapphire, optical glass, quartz, ceramics, metal and other hard and brittle materials.
Samples
Double side grinding machine
- Model No.:LP9B
- Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.
Features
- One-piece structure to ensure the stable structure and efficiency.
- Famous brand precision components to ensure the stability of grinding& polishing quality and warranty.
- Convenient parameter setting and process mode conversion.
- Specification and multi-power models are optional.
Technical Parameters
| Item | 13B | 13.9B | 15B |
| Plate size(mm) | Φ927 X Φ358 X 45 | Φ914 X Φ534 X 50 | Φ1024 X Φ412 X 50 |
| Max outline(mm) | Φ260 | Φ180 | Φ300 |
| Plate size(mm) | Φ933X Φ349 X 45 | Φ933 X Φ515 X 50 | Φ1041 X Φ395 X 50 |
| Max outline(mm) | Φ260 | Φ180 | Φ300 |
| Number | 6 | 9 | 6 |
| Tooth number(Metric system) | No | 114 | No |
| Modulo (Metric system) | No | 2 | No |
| Tooth number(British system) | 147 | 108 | 162 |
| Modulo (British system) | DP12 | DP12 | DP12 |
| No.1 motor | Yes | Yes | No |
| No.2 motor | Yes | Yes | Yes |
| No.3 motor | Yes | Yes | No |
| No.4 motor | No | No | No |
| 50mm | No | 72 | 126 |
| 75mm | 48 | 36 | 48 |
| 100mm | 30 | No | 30 |
| 125mm | 18 | No | No |
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