Ring shaped slicing multi-wire saw

  • Model No.:DS5056
  • Available Materials:large size wafer and crystal ring
  • Max Cutting Size:Φ560×500mm
  • Cutting Size:Straight flake&ring shape
  • Cutting Speed:max 1000m/min

Description

This series is a special machine designed for large size wafer and crystal ring cutting needs.The machining efficiency is improved with a high-precision.

Cutting Samples

 

Features

  • Underside workbench:upward movement more efficient with low kerf loss
  • For thick slice:slicing size from 5mm to 20mm
  • Low consumption:total consumption less than 35KW
  • Less guides reduced to 12 pieces:easy winding
  • Great tension&wire break memory system
  • High precision cutting
  • High speed:Max speed 1000m per min.
  • Simply&Convenient operation
  • Compact structure:One-piece Unit Structure
  • Much stable:the casted frame makes running environment stable

Technical Parameters

ItemDetailParameters
AbilityMax work sizeΦ560X500mm
Thickness5mm~20mm(Straight)
RollerComponentResin(PE or PU)
Workable diameter140mm≤Φd≤160mmx4
WireDiamond wire diameterΦ0.12mm-Φ0.25mm
Storage50km(Φ0.25mm)
Wire RunningRunning speedmax1000m/min
Repeat ratemax 12 times/min
Running directionBidirectional
WorkbenchLift strokemax 600mm
Lift speed0.1-999.9mm/hour
Mortar&FluidStorage220L
Flow rate170L/min
Control DevicesSystemPhase
Touch screen&PLC&Motion controller
Motor Power12 Servo Motor70.5kW
Mortar Motor3.5kW
Refrigerator8kW
Power&Air SupplyPowerAC380V Three-phase four-wire system
Power consumption≤35 kW
Air supplyAir pressure≥0.4Mpa
Size&WeightSize2570mm×2300mm×3235mm
Weight7500kg