Description
This series uses a single diamond wire to cut brittle hard materials such as sapphire and silicon carbide with a large size. It has the characteristics of high processing precision, fast routing speed and good stability.
Cutting Samples

This series uses a single diamond wire to cut brittle hard materials such as sapphire and silicon carbide with a large size. It has the characteristics of high processing precision, fast routing speed and good stability.
Cutting Samples

| Item | Detail | Parameters |
| Ability | Max work size | 400mmX400mmX400mm |
| Wire | Diamond wire diameter | Φ0.25mm-Φ0.37mm |
| Storage | 20km(Φ0.25mm) | |
| Swing angle | ±15℃ | |
| Wire Running | Running speed | max1200m/min |
| Repeat rate | max 12 times/min | |
| Running direction | Bidirectional | |
| Workbench | Horizontal stroke | max 400mm |
| Lift speed | 0.1-999.9mm/hour | |
| Mortar&Fluid | Storage | 70L |
| Flow rate | 100L/min | |
| Control Devices | System | INOVANCE |
| Touch screen&PLC&Motion controller | ||
| Motor Power | 8 Servo Motor | 17.8 kW |
| Mortar Motor | 0.1kW | |
| Power | Power | AC380V Three-phase four-wire system |
| Power consumption | ≤10 kW | |
| Size&Weight | Size | 1800mm×1800mm×1900mm |
| Weight | 1600kg | |