Diamond wire slice Line

  • Model No.:DW002
  • Available Materials:Sapphire/magnetic materials/crystal/glass/semiconductor silicon

Description

This series is mainly used for diamond wire for sapphire & magnetic materials slicing.

Application

Advantages

  • Reduce cutting cost
  • Improve TTV
  • Improve Warp
  • The cutting surface is smoother
  • The cutting accuracy is higher
  • Environment friendly

Technical Parameters

Product Name(DW002)Specification(mm)Application
Diamond wire for sapphire&magnetic materials slicing0.25Sapphire slicing
0.21Sapphire,Magnetic materials slicing
0.195Magnetic materials slicing
0.17Magnetic materials slicing
0.15Magnetic materials slicing
0.12Crystal,glass,semiconductor slicon slicing