Description
This series is mainly used for silicon squaring, cropping and silicon filament cutting
Application
Squaring cropping diamond wire
- Model No.:DW003
- Available Materials:Silicon
Advantages
- The cutting speed is 2~3times of that of slurry cutting.
- Improve TTV.
- Improve warp value.
- Good cutting surface quality.
- Good cutting accuracy.
- Energy saving.
Technical Parameters
| Product Name(DW003) | Specification(mm) | Application |
| Diamond wire for silicon squaring,cropping and silicon fiament cutting | 0.45 | Silicon squaring |
| 0.42 | Silicon squaring | |
| 0.37 | Silicon squaring,Cropping | |
| 0.35 | Silicon squaring,Cropping | |
| 0.30 | Silicon squaring,Cropping ,Silicon fiament cutting |
Related products
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Diamond wire slice Line
Learn More +- Model No.:DW002
- Available Materials:Sapphire/magnetic materials/crystal/glass/semiconductor silicon
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Diamond wire loops
Learn More +- Model No.:DW001
- Available Materials:Monocrystalline/Polycrystalline silicon/Precious stone / Semiconductor materials
- Length Range:1000mm-10000mm
-
Pricision slicing diamond wire
Learn More +- Model No.:DW004
- Available Materials:Semiconductor silicon,monocrystalline and polycrystalline silicon.
