Description
This series is a special machine designed for large size wafer and crystal ring cutting needs.The machining efficiency is improved with a high-precision.
Cutting Samples

This series is a special machine designed for large size wafer and crystal ring cutting needs.The machining efficiency is improved with a high-precision.

| Item | Detail | Parameters |
| Ability | Max work size | Φ560X500mm |
| Thickness | 5mm~20mm(Straight) | |
| Roller | Component | Resin(PE or PU) |
| Workable diameter | 140mm≤Φd≤160mmx4 | |
| Wire | Diamond wire diameter | Φ0.12mm-Φ0.25mm |
| Storage | 50km(Φ0.25mm) | |
| Wire Running | Running speed | max1000m/min |
| Repeat rate | max 12 times/min | |
| Running direction | Bidirectional | |
| Workbench | Lift stroke | max 600mm |
| Lift speed | 0.1-999.9mm/hour | |
| Mortar&Fluid | Storage | 220L |
| Flow rate | 170L/min | |
| Control Devices | System | Phase |
| Touch screen&PLC&Motion controller | ||
| Motor Power | 12 Servo Motor | 70.5kW |
| Mortar Motor | 3.5kW | |
| Refrigerator | 8kW | |
| Power&Air Supply | Power | AC380V Three-phase four-wire system |
| Power consumption | ≤35 kW | |
| Air supply | Air pressure≥0.4Mpa | |
| Size&Weight | Size | 2570mm×2300mm×3235mm |
| Weight | 7500kg | |