Tile-shaped slicing wire saw

  • Model No.:DS1160
  • Available Materials:Sapphire, silicon carbide crystal, monocrystalline silicon, ceramics etc
  • Max Cutting Size:110mmX600mmX130mmX2
  • Cutting Size:Straight flake&R-shaped pieces
  • Running Speed:max 1800m/min

Description

This series is mainly used for slicing hard and brittle materials such as crystal,artificial gem, monocrystalline silicon, ceramics, glass, precious metals,magnetic materials, etc. It can also cut arc-shaped pieces.

Cutting Samples

Features

  • Double station workbench:high cutting accuracy and cutting efficiency with low kerf loss
  • Low consumption:total consumption less than 35KW
  • Less guides reduced to 8 pieces&Easy winding
  • Wire break memory system:high precision cutting
  • High speed:Max speed 1800m per min.
  • Simply&Convenient operation
  • Compact structure:One-piece Unit Structure
  • Much stable:the casted frame makes running environment stable
  • Fast install:double core for rollers and line wheels.

Technical Parameters

ItemDetailParameters
AbilityMax work size110mmX600mmX130mmX2
RollerComponentResin(PE or PU)
Workable diameter140mm≤Φd≤160mmx4
Diamond wire diameterΦ0.12mm-Φ0.25mm
Storage30km(Φ0.25mm)
Wire RunningRunning speedmax1500m/min
Repeat ratemax 12 times/min
Running directionBidirectional
WorkbenchLift strokemax 180mm
Lift speed0.1-999.9mm/hour
Mortar&FluidStorage83L
Flow rate170L/min
Control DevicesSystemSIMENS
Touch screen&PLC&Motion controller
Motor Power9 Servo Motor53.2kW
Mortar Motor3.8kW
Refrigerator3.5kW
Power&Air SupplyPowerAC380V Three-phase four-wire system
Power consumption≤30 kW
Air supplyAir pressure≤0.4Mpa
Size&WeightSize2110mm×3670mm×2640mm
Weight9600kg