Diamond wire sawing

  • Model No.:DS6550
  • Available Materials:monocrystalline silicon, ceramics, glass, precious metals.
  • Max Cutting Size:650mm×650mm×500mm
  • Running Speed:1000m/min

Description

This series is mainly uses diamond wire cutting monocrystalline silicon, ceramics, glass, precious metals and other hard brittle materials. It has a precise temperature control system, high slice precision, small warpage, stable slice quality and low cutting cost.

Cutting Samples

Features

  • Max wire running speed:1000m/min
  • Upper workbench:workpiece drop cutting.
  • Swing slicing:swing angle 0~7.5
  • The guides quantity reduced to 14
  • Wire break memory system
  • The total consumption is less than 35KW
  • The casted frame makes running environment stable
  • Double cone for rollers and line wires ensure to fast install.

Technical Parameters

ItemDetailParameters
AbilityMax work size650mmX650mmX500mm
RollerComponentResin(PE or PU)
Workable diameter140mm≤Φd≤160mmx4
WireDiamond wire diameterΦ0.25mm-Φ0.37mm
Storage50km(Φ0.25mm)
Wire RunningRunning speedmax1000m/min
Repeat ratemax 12 times/min
Running directionBidirectional
WorkbenchLift strokemax 730mm
Swing angle±7.5°
Lift speed0.1-999.9mm/hour
Mortar&FluidStorage830L
Flow rate170L/min
Control DevicesSystemSIMENS
Touch screen&PLC&Motion controller
Motor Power12 Servo Motor78kW
Mortar Motor3.7kW
Refrigerator3.5kW
Power&Air SupplyPowerAC380V Three-phase four-wire system
Power consumption≤40 kW
Air supplyAir pressure≥0.4Mpa
Size&WeightSize2580mm×2580mm×3450mm
Weight120000kg