This series is mainly suitable for high speed and high precision multi-chip cutting of 6 inches and lower semiconductor materials (such as Silicon, Silicon Carbide, gallium Arsenide, indium phosphate, etc.) hard & brittle materials such as sapphire, silica, ceramics, glass, and crystal.
Cutting Samples
| Item | Detail | Parameters |
| Ability | Max work size | Φ150*300(mm) |
| Principal Axis | Φ190±7.5*310*2(mm) | |
| Roller | Component | Resin(PE or PU) |
| Spindle spacing | 450mm | |
| Wire | Diamond wire diameter | Φ0.10~Φ0.25(mm) |
| Wire Running | Running speed | max720m/min |
| Running direction | Bidirectional | |
| Workbench | Max Workbench speed | 300mm/min |
| Workbench itnerary | 225mm | |
| Swing angle | ±7° | |
| Swing frequency | 30 | |
| Lift speed | 0.01~9.99mm/min | |
| Mortar&Fluid | Storage | 90L |
| Flow rate | 200L/min | |
| Touch screen&PLC&Motion controller | ||
| Motor Power | Spindle drive motor | 17.8kW |
| Mortar Motor | 4kW | |
| Tesion motor | 4.15kW | |
| Power&Air Supply | Power | AC380V Three-phase five-wire system |
| Noise | ≤75dB(A) | |
| Size&Weight | Size | 2550mm×1900mm×2450mm |
| Weight | 5500kg | |
