Showing 10–18 of 37 results

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  Diamond wire slice Line

  • Model No.:DW002
  • Available Materials:Sapphire/magnetic materials/crystal/glass/semiconductor silicon
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  Diamond wire slicing machine

  • Model No.:DS3050
  • Available Materials:semiconductor silicon wafers
  • Max Cutting Size:φ300mm×500mm×300mm
  • Running Speed:1500m/min
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  Double side grinding machine

  • Model No.:LP9B
  • Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.
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  Double side polishing machine

  • Model No.:LP13B
  • Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.
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  Double side polishing machine

  • Model No.:LP20B
  • Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.
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  Double surface lapping machine

  • Model No.:LP16B
  • Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.
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  Lapping plate

  • Model No.:CA005
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  Large size multi-wire saw

  • Model No.:DS4250
  • Available Materials:Large size magnet
  • Max Cutting Size:420mm×500mm×170mm
  • Cutting Size:Straight flake
  • Running Speed:max 1100m/min
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  Low kerfloss diamond wire saw

  • Model No.:DS600
  • Available Materials:crystal, artificial gem,monocrystalline silicon, ceramics ect.
  • Max Cutting Size:165mm×600mm×130mm
  • Running Speed:1800m/min
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