Showing 28–36 of 37 results

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  Semiconductor wire saw slicing machine

  • Model No.:DS300
  • Available Materials:sapphire,silica,ceramics,crystal ,semiconductor materials
  • Max Cutting Size:φ150mm×300mm
  • Cutting Speed:0～9.99mm/min
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  Silicon multi-wire saw

  • Model No.:DS350
  • Available Materials:silicon Carbide, gallium nitride and sapphire.
  • Max Cutting Size:φ205mm×350mm   220mm×200mm×350mm
  • Running Speed:1500m/min
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  Single swing diamond wire saw

  • Model No.:DA600
  • Available Materials:silicon carbide, sapphire, quartz, ceramics ect.
  • Max Cutting Size:600mm(φ600mm)×500mm
  • Cutting Speed:0～9.99mm/min
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  Single-sided polisher grinder

  • Model No.:SP305
  • Available Materials:semiconductor, sapphire, optical glass, quartz, ceramics, metal and other brittle materials.
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  Squaring cropping diamond wire

  • Model No.:DW003
  • Available Materials:Silicon
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  Squaring single wire saw

  • Model No.:DA1000
  • Available Materials:Large size brittle&hard materials
  • Max Cutting Size:1000mm×1000mm×500mm
  • Cutting Size:Straight flake
  • Cutting Speed:max 1200m/min
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  Tile-shaped slicing wire saw

  • Model No.:DS1160
  • Available Materials:Sapphire, silicon carbide crystal, monocrystalline silicon, ceramics etc
  • Max Cutting Size:110mmX600mmX130mmX2
  • Cutting Size:Straight flake&R-shaped pieces
  • Running Speed:max 1800m/min
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  Ultrathin slicing diamond wire saw

  • Model No.:DS2131
  • Available Materials:under 4mm thickness brittle&hard materials
  • Max Cutting Size:210mm×310mm×100mm
  • Cutting Size:thinner Straight flake
  • Running Speed:max 1000m/min
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  Wire feeding

  • Model No.:CA002
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