Showing 1–9 of 14 results

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  Diamond wire sawing

  • Model No.:DS6550
  • Available Materials:monocrystalline silicon, ceramics, glass, precious metals.
  • Max Cutting Size:650mm×650mm×500mm
  • Running Speed:1000m/min
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  Diamond wire slicing machine

  • Model No.:DS3050
  • Available Materials:semiconductor silicon wafers
  • Max Cutting Size:φ300mm×500mm×300mm
  • Running Speed:1500m/min
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  Large size multi-wire saw

  • Model No.:DS4250
  • Available Materials:Large size magnet
  • Max Cutting Size:420mm×500mm×170mm
  • Cutting Size:Straight flake
  • Running Speed:max 1100m/min
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  Low kerfloss diamond wire saw

  • Model No.:DS600
  • Available Materials:crystal, artificial gem,monocrystalline silicon, ceramics ect.
  • Max Cutting Size:165mm×600mm×130mm
  • Running Speed:1800m/min
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  Magnet multi-wire saw

  • Model No.:DS1831
  • Available Materials:Magnetic brittle&hard materials
  • Max Cutting size: 180mmX310mmX100mm
  • Cutting Size:Straight flake&R shape
  • Cutting Speed:max 1200m/min
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  Mass slicing multi-wire saw

  • Model No.:DS2260
  • Available Materials:under 8mm brittle&hard materials
  • Max Cutting Size:220mm×600mm×180mm
  • Cutting Size:Straight flake
  • Running Speed:max 1800m/min
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  R shaped multi wire saw

  • Model No.:DS2240R
  • Available Materials:under 8mm brittle&hard materials
  • Max Cutting Size:220mm×400mm×160mm
  • Cutting Size:Straight flake&R-shaped pieces
  • Running Speed:max 1500m/min
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  Ring shaped slicing multi-wire saw

  • Model No.:DS5056
  • Available Materials:large size wafer and crystal ring
  • Max Cutting Size:Φ560×500mm
  • Cutting Size:Straight flake&ring shape
  • Cutting Speed:max 1000m/min
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  Sapphire 4inch multi-wire saw

  • Model No.:DS102S
  • Available Materials:4inch sapphire
  • Max Cutting Size:Φ102X300mm
  • Cutting Size:Straight flake
  • Cutting Speed:max 1200m/min
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