Showing 10–14 of 14 results

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  Sapphire slicing multi wire saw

  • Model No.:DS106S
  • Available Materials:Sapphire
  • Max Cutting Size:Φ160mmX340mm
  • Cutting Size:Straight flake
  • Running Speed:max 1500m/min
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  Semiconductor wire saw slicing machine

  • Model No.:DS300
  • Available Materials:sapphire,silica,ceramics,crystal ,semiconductor materials
  • Max Cutting Size:φ150mm×300mm
  • Cutting Speed:0～9.99mm/min
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  Silicon multi-wire saw

  • Model No.:DS350
  • Available Materials:silicon Carbide, gallium nitride and sapphire.
  • Max Cutting Size:φ205mm×350mm   220mm×200mm×350mm
  • Running Speed:1500m/min
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  Tile-shaped slicing wire saw

  • Model No.:DS1160
  • Available Materials:Sapphire, silicon carbide crystal, monocrystalline silicon, ceramics etc
  • Max Cutting Size:110mmX600mmX130mmX2
  • Cutting Size:Straight flake&R-shaped pieces
  • Running Speed:max 1800m/min
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  Ultrathin slicing diamond wire saw

  • Model No.:DS2131
  • Available Materials:under 4mm thickness brittle&hard materials
  • Max Cutting Size:210mm×310mm×100mm
  • Cutting Size:thinner Straight flake
  • Running Speed:max 1000m/min
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